Semi-Pac Inc. is a leading provider of advanced packaging services and innovative process development for a wide range of industries, including semiconductor packaging and medical device development. With a strong track record of delivering on their promises, they have earned high levels of customer satisfaction and are known for their expertise in reliability packaging, wafer bumping, and medical compliance.
With a team of experienced professionals, Semi-Pac Inc. offers on-site assembly services, process development, and patented technologies to meet the most challenging project requirements. Their comprehensive range of services includes wire bonding, wafer sawing, wafer dicing, and PCB assembly, making them a reliable partner for companies seeking excellence in semiconductor packaging and medical device manufacturing.
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