BroadPak Corporation is a leading provider of innovative total solutions for 2.5D and 3D products, specializing in deep learning, datacenter networking, AR/VR, and autonomous driving applications. With a strong presence in the industry, BroadPak offers a range of services and co-design methodologies for advanced heterogeneous integration, scalable 3D-HI through packaging transformation, and large-scale silicon interposer design.
As a key player in the market, BroadPak has been actively participating in various international conferences and events, presenting their cutting-edge technologies and sharing insights on the latest trends in the industry. With a focus on 3D integration technologies, BroadPak continues to contribute to the development of innovative solutions for performance-driven markets, meeting the increasing bandwidth needs of cloud computing and supercomputing applications.
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